הייטק
you will be leading the design and process development of optical semiconductor packaging.
You will be required to work independently with suppliers and sub-contractors worldwide.
The position requires broad experience with opto-electronics, materials, IC packaging and qualification methods.
Requirements
B.Sc / M.Sc in Materials, Physics, Electro-Optics, Mechanical Eng. or similar discipline. PhD – advantage.
Broad material and fabrication knowledge and 3+ years of assembly process development experience in opto-electronics..
Knowledge of assembly processes
Strong laboratory skills, including, data collection, data analysis, technical writing, and presentation skills.
Proven experience in specifying, analyzing and testing optical components and systems.
Proven experience in global supplier and subcontractor management.
Knowledge and practical experience in characterization of semiconductor lasers and photodiodes – advantage.
Highly Independent
Process development methodology
Strong troubleshooting and root cause analysis skills.
Ability to work cross-functionally as both a team leader and a contributor.
Self-learner
“Can do” attitude
Matlab
מועד אחרון להגשות: 01/11/2030